JPH0414177Y2 - - Google Patents
Info
- Publication number
- JPH0414177Y2 JPH0414177Y2 JP9955086U JP9955086U JPH0414177Y2 JP H0414177 Y2 JPH0414177 Y2 JP H0414177Y2 JP 9955086 U JP9955086 U JP 9955086U JP 9955086 U JP9955086 U JP 9955086U JP H0414177 Y2 JPH0414177 Y2 JP H0414177Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- cheese
- cavity
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 13
- 235000013351 cheese Nutrition 0.000 claims description 12
- 238000001721 transfer moulding Methods 0.000 claims description 9
- 230000013011 mating Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000002129 Malva sylvestris Species 0.000 description 1
- 235000006770 Malva sylvestris Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 244000000231 Sesamum indicum Species 0.000 description 1
- 235000003434 Sesamum indicum Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- -1 etc. Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9955086U JPH0414177Y2 (en]) | 1986-06-28 | 1986-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9955086U JPH0414177Y2 (en]) | 1986-06-28 | 1986-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636817U JPS636817U (en]) | 1988-01-18 |
| JPH0414177Y2 true JPH0414177Y2 (en]) | 1992-03-31 |
Family
ID=30968529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9955086U Expired JPH0414177Y2 (en]) | 1986-06-28 | 1986-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414177Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717456Y2 (ja) * | 1989-03-16 | 1995-04-26 | 光洋精工株式会社 | 射出成形用金型 |
-
1986
- 1986-06-28 JP JP9955086U patent/JPH0414177Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636817U (en]) | 1988-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6012203B2 (ja) | フラツシユレス金型装置 | |
| KR940002440B1 (ko) | 반도체장치의 수지봉지장치 | |
| CN109702943B (zh) | 树脂成形品的制造装置与制造方法、树脂成形系统 | |
| JPH0694135B2 (ja) | 樹脂封止装置 | |
| JPH0414177Y2 (en]) | ||
| US5882692A (en) | Resin molding apparatus | |
| JP3554951B2 (ja) | 金型位置決め装置 | |
| JPH05200789A (ja) | プラスチックレンズの射出成形用金型および射出成形 方法 | |
| JPH036410Y2 (en]) | ||
| CN109702944B (zh) | 树脂成形品的制造装置及制造方法、以及树脂成形系统 | |
| JP3735181B2 (ja) | 電子部品の樹脂封止成形方法及び金型 | |
| JPH11333882A (ja) | 半導体装置の樹脂封止用金型 | |
| JPH1022314A (ja) | 半導体樹脂封止用金型 | |
| JPH0414178Y2 (en]) | ||
| CN215203221U (zh) | 一种具有矫正功能的手机壳模胚 | |
| JPH0324345Y2 (en]) | ||
| KR102580612B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
| JP2992982B2 (ja) | 電子部品の樹脂封止部成形用金型装置 | |
| JPS6279632A (ja) | 樹脂封止装置 | |
| JPS63175435A (ja) | 半導体装置用モ−ルド金型 | |
| JPH06314717A (ja) | 離型荷重測定用金型とこれを用いた離型荷重測定方法 | |
| JP2001232655A (ja) | 樹脂成形品の成形方法及び成形用金型及び樹脂成形品 | |
| JPH0590314A (ja) | 半導体の樹脂封止成形方法 | |
| JPS63181438A (ja) | 半導体装置の樹脂封止用金型 | |
| JPH05329890A (ja) | 樹脂成形装置 |